Angesen
لوح التدفئة تحت الأرضية
Specialized backer board for underfloor heating with pre-routed pipe channels. Excellent thermal insulation (0.030 W/(m·K)) prevents downward heat loss and improves heating efficiency. 30mm standard thickness for water-based systems.
المواصفات
- Standard Thickness
- 30mm (hydronic)
- Thermal Conductivity
- 0.030 W/(m·K)
- Material
- XPS core + polymer coating
- Pipe Spacing
- ≤150mm
الميزات
- Pre-routed pipe channels for neat installation
- Excellent insulation prevents downward heat loss
- Improves heating system efficiency
- Unified with backer board system
الأحجام المتاحة
Standard: 30mm hydronic, 30mm electric
التطبيقات
حماممساحة معيشةتدفئة تحت الأرضية
